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We realize that during mechanical deformation, electropulsing enhances cross-slip, producing a wavy dislocation morphology, and improves twinning, which will be comparable to what does occur during cryogenic deformation. For that reason, dislocations tend to be avoided from localizing into planar slide bands that could lead into the early failure of the alloy under stress. Our results show that this macroscopic electroplastic behaviour comes from defect-level micr