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In the present work, nano Cu (0, 5, 10, 15, 20, 25 wt.%) was added to W, and W-Cu composites were fabricated using the spark plasma sintering (S.P.S.) technique. The densification, microstructural evolution, tensile strength, micro-hardness, and electrical conductivity of the W-Cu composite samples were evaluated. It was observed that increasing the copper content resulted in increasing the relative sintered density, with the highest being 82.26% in the W75% + Cu25% composite. The XRD phase analysis indicated that there was no evidence of
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