https://www.selleckchem.com/products/a-485.html
In recent years, high-performance half-Heusler compounds have been developed as promising thermoelectric materials for power generation. Aiming at practical device applications, one key step is to seek suitable metal electrodes so that low interfacial resistivity is guaranteed under long-term thermal aging. In the previous work, the fresh Mo/Nb0.8Ti0.2FeSb junction was found exhibiting low contact resistivity below 1 μΩ cm2; however, it increased by tens of times under long-term thermal aging, mainly originating from the formation of the
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