https://www.selleckchem.com/pr....oducts/gsk3326595-ep
Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics due to their improved mechanical properties. The main limitation is the dispersion of nanoparticles in the solder alloy. Accordingly, in this work, varying additions of ZnO nanoparticles were successfully dispersed into Sn57Bi solder via the liquid-state ultrasonic treatment. Nanocomposite solders were prepared using the melting and casting route. The solder alloys were then characterized for microstructure, spreading and mechanical propertie